Sr. Fellow Engineer

Location: Austin, Texas, US

Company: Advanced Micro Devices

Apply now

Apply for Job


What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

What you do at AMD changes everything

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, Immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Leader – Advanced Package Development

 

THE ROLE:

Lead a team of development engineers to explore, develop and productize new package solutions with a focus on chiplet integration processes in advanced silicon nodes.

 

THE PERSON:

The candidate should have a proven track record in leadership roles in advanced packaging development and have a hands-on approach to new process development. Excellent oral and written communication skills are required to communicate ideas with Technology Partners, Colleagues, product architects and AMD management.

 

KEY RESPONSIBILITIES:

  • Lead a distributed team of development engineers in a fabless environment
  • Identify, develop and evangelize cutting edge package solutions for AMD products
  • Partner with AMD architects, designers, and product owners to develop high yielding, cost effective solutions which meet product requirements
  • Select development partners in AMD supply chain to invest and develop these concepts.
  • Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept though NPI.
  • Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.

 

PREFERRED EXPERIENCE:

  • The candidate should be familiar with advanced packaging techniques including fan out, 3D stacking, 2.5D and advanced substrate processing techniques for feature minimization.

 

ACADEMIC CREDENTIALS:

  • PHD physics, Materials Science or equivalent

 

LOCATION:

Santa Clara or Austin


#LI-MD1



Requisition Number: 78884 
Country: United States State: Texas City: Austin 
Job Function: Other Engineering
  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

Apply now

Apply for Job

Share this Job