Foundry Packaging Engineer, Advanced Technology - 83541

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

The Role

Drive technology development and initial supply chain bring up of advanced 2.5D/3D package architectures to support new AMD products.
 

The Person

The candidate should have at least 2 years of experience in related companies and have a proven track record in developing foundry technologies, wafer process technologies and have experience with BEOL process integration. He/she should have a hands-on approach to new process development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.
 

Key Responsibilities

  • Identify, develop, and productize cutting edge advanced packaging for AMD products.
  • Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements.
  • Select development partners to bring into AMD supply chain to invest and develop these concepts.
  • Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI.
  • Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.
     

Preferred Experience

  • Have working knowledge and/or hands on experience in BEOL technologies.
  • The candidate should be familiar with advanced packaging techniques including fan-out, 3D stacking, 2.5D and MCM packaging techniques for improved functionality at the lowest cost.
     

Academic Credentials

M.S. or PHD in Solid State Physics, EE, Materials Science and Engineering or equivalent

 



Requisition Number: 83541 
Country: United States State: Austin City: Texas 
Job Function: 
Package Engineering
Hiring Manager: 
Rahul Agarwal

 

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AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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