Lead Packaging Engineer, Yield (100841)

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Lead Packaging Engineer, Yield (100841)
 

The Role
 

As a member of AMD's Advanced Packaging Engineering team, you will serve in a Yield Engineering role in which you will collaborate with product design teams and technology development partners to understand future product needs and define a yield roadmap that includes Design for Manufacturing (DFM)/Design for Yield (DFY) guidelines. In this role you will drive technology development and initial supply chain bring up of advanced 2.5D/3D package architectures to support new AMD products.

The Person

  • Experience in semiconductor device physics and have a proven track record in analyzing test data, process integration and yield improvement. He/she should have a hands-on approach to using data extraction and analytics tools such as SQL, Python, JMP/JSL
  • Excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.

Key Responsibilities

  • Working with various teams such as BU, Design, Product, Quality, Reliability and Testing teams to define requirements of new products and manage technology development meeting product requirements.
  • Partnering with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions.
  • Work closely with Quality/Reliability and production groups to qualify packages and ensure DFM/DFR/DFY
  • Work with supply chain team and develop systems for new packaging platforms.
  • Drive yield improvement, and debug test data for root causes analysis.
  • Identify and resolve integration issues that impact Yield or Quality metrics.
  • Own production control monitors and Cp/Cpk at suppliers.

Preferred Experience

  • Experience with driving yield improvement on advanced packaging architectures such as 2.5D, 3D die stacking.
  • Have fundamental knowledge of device physics, product engineering and yield analysis.
  • Familiarly with advanced packaging techniques such as fan-out, 3D stacking, 2.5D and MCM packaging techniques is beneficial.

Academic Credentials

  • BS/MS/PhD in Computer Science, Applied Mathematics, Electrical Engineering, Mechanical Engineering or equivalent.

Location

Austin, TX

 

#LI-MD1
 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV



Requisition Number: 100841
Country: United States State: Texas City: Austin
Job Function: 
Packaging Engineering 

 

#LI-RJ1

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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