Packaging Engineer - 118566

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

THE ROLE

As part of the Packaging engineering team, execute and coordinate Flip Chip packaging end-to-end productization, including scoping and feasibility activities to high volume manufacturing for support of product bring up and execution to meet performance, cost, schedule, reliability, and quality requirements with diverse packaging technology portfolio.

 

THE PERSON

Strong organizational skill to coordinate and drive Flip Chip Packaging technology elements and milestones across internal and external teams for mature product readiness and robust manufacturing.

 

KEY RESPONSIBILITIES

  • Experience / knowledge with Package design, Assembly, and substrate with organic Flip Chip packages, driving material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable DFM and Assembly yield targets.
  • Work with chip design, and product teams to recommend the optimum package solutions to support electrical, mechanical, thermal, and system level needs to meet manufacturability, cost, and performance requirements.
  • Interface closely with AMD’s assembly and material partners, to develop and productize in bring up of new packaging technology from concept to NPI and prototyping to mass production phases with acceptable sustaining yields.
  • Good track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
  • Support and collaborate with customers to ensure that AMD packages/products can meet their quality, reliability, system, and operational needs.
  • In depth knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.
  • Lead and create package program schedule for package types with SCM, MCM, and 2.5D and integration with product milestones and customer commitments.
  • Lead and perform DOE definition for bump/assembly optimization process to complete the NPI and ramp up to HVM at OSAT’s with optimum yield targets.
  • Knowledge in SI/PI associated with substrate design and construction.

 

PREFERRED EXPERIENCE

  • Experience with WLFO technology, including manufacturing, and module assembly.   
  • In depth experience with Flip Chip 2.5D, MCM, single chip, Chiplet assembly and material manufacturability process characterization, NPI, CPI, qualifications of component and at board level, Failure Analysis, and assembly process optimization.
  • Experience with industry wafer bump, assembly, substrate technology, material trends, and design rules capability, for 2.5D, MCM, single chip, Chiplet Organic Flip Chip packages.
  • Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.
  • Knowledge in substrate design, manufacturing, and assembly interactions.
  • Strong problem solving, communication, organizational, interpersonal, and presentation skills.

 

ACADEMIC CREDENTIALS

  • Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhD preferred.

 

LOCATION

Austin, TX

 

AMD is a government contractor and subcontractor. As required by Executive Order, our US employees are required to be fully vaccinated against COVID-19 regardless of the employee’s work location or work arrangement (e.g., telework, remote work, etc.), subject to such exceptions as required by law. If selected, you will be required to be vaccinated against COVID-19 and submit documentation of proof of vaccination by December 8, 2021. AMD will provide additional information regarding what information or documentation will be needed and how you can request an exception from this requirement if you have a need for a religious and/or medical accommodation.

 

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Requisition Number: 118566 
Country: United States State: Texas City: Austin 
Job Function: Packaging Engineering
  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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