Package Reliability Engineer (PMTS)

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Package Reliability Engineer (PMTS)

THE ROLE:

Join a global package reliability team that drives package and board-level reliability activities across AMD’s 3nm/5nm IC and graphics-card products that employ advanced flipchip and chiplet package constructions. Collaborate with colleagues across AMD Global Operations, business units, and a worldwide external supply base. Take on individual responsibility to establish a technical and business framework for an advanced package reliability team.

THE PERSON:

An analytical person and group leader, with demonstrated history of meeting complex technical challenges, coordinating multi-disciplinary engineering teams, and devising innovative solutions using depth and breadth of knowledge in advanced wafer/packaging processes, materials, and constructions.

 

KEY RESPONSIBILITIES: 

  • Establish a coordinated package reliability program between Package Reliability, Advanced Packaging, External Manufacturing Operations, Board Operations, and external mfg. partners for the next generation of advanced packages, data center GPU, and graphics cards.
  • Implement a physics-of-failure (PoF) package reliability methodology that addresses failure modes and mechanisms of complex chiplet wafer/package solutions.
  • Develop a package reliability risk mitigation program to optimize reliability of interconnects, packaging, and board-level reliability of advanced 2.5D, 3D, and WLFO devices.

 

PREFERRED EXPERIENCE:

  • Professional experience required.
  • Reliability expertise in advanced packaging and Si processing for high-performance semiconductor products.
  • Expert knowledge of semiconductor packaging materials and constructions.
  • Knowledge of circuit board materials, assembly, and sockets/connectors.
  • Strong written and oral communication skills, including comprehensive technical reports and presentations.
  • Ability to thrive as a collaborator/leader in a diverse, multi-national organization.
  • Familiarity with JMP and Python is helpful.

 

ACADEMIC CREDENTIALS: 

PhD in Mechanical Engineering, Materials Science, or Physics.

 

LOCATION:

Austin, TX

 

#LI-AM1


Requisition Number: 174244 
Country: United States State: Texas City: Austin 
Job Function: Reliability & Test
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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