Packaging Engineer

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Packaging Engineer (103166)

THE ROLE
 

As part of AMD's Packaging Engineering team, you will execute and coordinate Flip Chip packaging and end-to-end productization, including scoping and feasibility activities in support of product bring-up. You will be tasked to meet performance, cost, schedule, reliability, and quality requirements across a diverse packaging technology portfolio.

The person

This individual will possess strong organizational skills, with the ability to coordinate and drive Flip Chip Packaging technology elements and milestones across internal and external teams, preparing mature product readiness and robust manufacturing.

Key responsibilities

  • Experience / knowledge with Package design, Assembly, and Substrate with organic Flip Chip packages.
  • Experience driving material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable DFM and Assembly yield targets.
  • Working with Chip Design, Quality, Reliability, SI/PI, Board, and Product and product teams to recommend optimum package solutions to support electrical, mechanical, thermal, and system level needs to meet manufacturability, cost, and performance requirements.
  • Interface closely with AMD’s assembly and material partners to develop and productize bring-up of new packaging technology - from concept, to NPI and prototyping, to mass production phases with acceptable sustaining yields.
  • Solid track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
  • Support and collaborate with customers to ensure that AMD packages/products can meet their quality, reliability, system, and operational needs.
  • In depth knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.
  • Lead and create package program schedule for package types with SCM, MCM, and 2.5D and integration with product milestones and customer commitments.
  • Lead and perform DOE definition for bump/assembly optimization process to complete the NPI and ramp up to HVM at OSAT’s with optimum yield targets.
  • Knowledge in SI/PI associated with substrate design and construction.

Preferred experience

  • In depth experience with Flip Chip 2.5D, MCM, single chip, Chiplet and WLFO assembly and material manufacturability process characterization, NPI, CPI, qualifications of component and at board level, Failure Analysis, and assembly process optimization.
  • Experience with industry wafer bump, assembly, substrate technology, material trends, and design rules capability, for 2.5D, MCM, single chip, Chiplet Organic Flip Chip packages.
  • Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.
  • Knowledge in substrate design, manufacturing, and assembly interactions.
  • Strong problem solving, communication, organizational, interpersonal, and presentation skills.

Academic credentials

  • Bachelor/Master of Science in Materials, Electrical engineering, or Mechanical engineering. MS or PhD preferred.

Location

Austin, TX
 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV.



Requisition Number: 103166
Country: United States State: Texas City: Austin
Job Function: 
Packaging Engineering 


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AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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