Packaging Engineer

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

External Silicon Integration

 

THE ROLE:

Drive technology development and supply chain bring up of external silicon like new memory technologies (HBM, other new memory), accelerators, E/O chiplets, and other chiplets designed by 3rd parties to support new AMD products.

 

THE PERSON:

The candidate should have a proven track record in developing new silicon-package technologies at Fabless/IDM ecosystem, with specific background in memory integration (HBM, WIO2, LPDDRx), chip-package interactions, as well as identifying and enabling new ecosystem partners. He/she should have a hands-on approach to new technology development, as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, product architects and AMD management.

 

KEY RESPONSIBILITIES:

•            Identify, develop and productize new memory and external silicon/package technologies for AMD products

•            Partner with AMD architects, designers, and product owners to develop high yielding, cost effective on package silicon solutions (memory, E/O, accelerators) which meet product requirements

•            Work with select development partners to define external silicon electrical, mechanical and manufacturability specs to drive product cost, yield, performance and reliability targets and bring into AMD supply chain to invest and develop these concepts.

•            Partner with Product teams and Manufacturing Engineering to demonstrate CPI, manufacturing process, reliability and smoothly transition new silicon technologies from concept though NPI.

•            Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.

 

PREFERRED EXPERIENCE:

•            The candidate should be familiar with CPI integration, external memory integration at Fabless/IDM ecosystem. He/she should have a hands-on approach to solve CPI, process as well as reliability issues with external silicon partners.

 

ACADEMIC CREDENTIALS:

•            PHD in Solid State Physics, Chemistry, Materials Science, Chemical Engineering or equivalent.

 

LOCATION:

Austin, TX

#LI-SD1

AMD is a government contractor and subcontractor. As required by Executive Order, our US employees are required to be fully vaccinated against COVID-19 regardless of the employee’s work location or work arrangement (e.g., telework, remote work, etc.), subject to such exceptions as required by law. If selected, you will be required to be vaccinated against COVID-19 and submit documentation of proof of vaccination by December 8, 2021. AMD will provide additional information regarding what information or documentation will be needed and how you can request an exception from this requirement if you have a need for a religious and/or medical accommodation.


Requisition Number: 157908 
Country: United States State: Texas City: Austin 
Job Function: Packaging Engineering
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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