Senior Packaging Engineer

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

THE ROLE

As part of the AMD's Advanced Packaging team, you will drive technology development and the Supply Chain management of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.

 

THE PERSON

The candidate should have a hands-on approach to new process development, strong organizational and communication skills to drive the 3D technology development and robust manufacturing bring up with internal partners as well as suppliers.

The candidate should have knowledge and experience in wafer level process Integration, BEOL Integration, 2.5D/3D integration with TSV, Hybrid Bonding etc.

 

 

KEY RESPONSIBILITIES

  • Interface closely with Foundry and development partners to lead and perform DOE definition for process optimization, yield and reliability improvement.
  • Interface closely with AMD’s assembly and material partners, to develop and productize in bring up of new packaging technology from concept to NPI and prototyping to mass production phases with acceptable sustaining yields.
  • Work with chip design, and product teams to recommend the optimum 3D technology to support electrical, mechanical, thermal, and system level needs to meet manufacturability, cost, and performance requirements.
  • Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.
  • Support and collaborate with customers to ensure that AMD packages/products can meet their quality, reliability, system, and operational needs

 

PREFERRED EXPERIENCE

  • Strong problem solving, communication, organizational, interpersonal, and presentation skills.
  • Fundamental knowledge and hands on experience in BEOL technologies and TSV integration.
  • Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
  • Familiarity with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques for improved functionality at the lowest cost.
  • Good track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
  • Knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.

 

ACADEMIC CREDENTIALS

  • Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhD preferred.

 

#LI-DD1

 

 


Requisition Number: 178523 
Country: United States State: Texas City: Austin 
Job Function: Packaging Engineering
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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