MTS Packaging Engineer

Location: Austin, Texas, US

Company: Advanced Micro Devices

Apply now

Apply for Job


What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Packaging and SMT process engineer

Description

  • This person would be responsible for managing several client packaging needs in AMD’s packaging group.
  • Work closely with PCB and SMT houses to design Package level reflow DOEs to fine tune package warpage control during reflow.
  • Strong process engineering background to analyze and monitor manufacturing quality data.
  • Partner with Board OEM and ODM houses and internal board operations team to understand and study most common SMT problems/failures and devise solutions to eliminate the issues encountered
  • Work closely with Package reliability, assembly engineering, mechanical simulation group to chalk up package assembly DOE plans, coordinate assembly builds, scrutinize package qualification plans, monitor package reliability testing, failure analysis and modify processes to meet intended needs of long term reliable performance packages.

 

Skills/Experience

  • Experience in semiconductor Packaging assembly and/or module assembly development 
  • Knowledge on FMEA, SPC for processes
  • Experience dealing with external vendors , process engineers
  • Excellent statistics background with proficiency using tools such as JMP to analyze process data sets, create DOE and draw data trends
  • Expected to lead data analysis efforts to establish parameter correlations, variability and assist in spec setting
  • Excellent communication and organizational skills.
  • Ability to work efficiently in a variety of engineering assignments
  • Team player and must be able to work well with others.
  • Knowledge on using CAD tools, JMP. Microsoft project experience plus

 

Additional Responsibilities

  • Use engineering skills to develop automation scripts to simplify and streamline repetitive tasks
  • Manage project schedules, identifying risks and clearly communicating them to project stakeholders.
  • Define design process and methodologies to improve project efficiency.

#LI-SD1


Requisition Number: 148302 
Country: United States State: Texas City: Austin 
Job Function: Packaging Engineering
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

Apply now

Apply for Job

Share this Job