Packaging Engineer (82093)

Location: Santa Clara, California, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Sr IC Packaging Engineer

The Role:

AMD’s Packaging Engineering team is looking for an experienced IC Sr Packaging Engineer who will help seek sophisticated technical challenges to deliver robust, reliable, efficient packages & drive assembly solutions aligned with the end-product requirements. AMD is bolder than ever, focused, and energized - you can make a career move that matters! Help turn "possibility" into "reality" every day!

 

The Person:

Will drive packaging, product risk assessment, mitigation plans, and establishing best-known processes methodologies to ensure robust package quality, reliability, and manufacturing yield.

Performing risk assessments, creating program schedules, and ownership of successful project executions within target landmark schedules/customer commitments.

Possesses excellent problem solving, communication, organizational, interpersonal, and presentation skills.

 

Key Responsibilities:

  • Drive productization end to end from package concept to NPI, HVM, project running packaging aspects to meet cost/manufacturability, signal integrity, package design, Flip Chip assembly, CPI, mechanical/thermal requirements.
  • Work with chip design, product engineering, development and manufacturing teams, to recommend the optimum package solutions to meet program schedules, component and system level performance expectations.
  • Interface closely with assembly manufacturing and material partners, to develop and bring up new packaging technology from definition to prototyping and mass production.
  • Execute and coordinate Flip Chip packages in single chip, MCM, and 2.5D/3D in material optimization, manufacturability process characterization, NPI, CPI, package qualifications of component and board level, failure analysis, and thermal/mechanical interactions, with strong problem solving skills.
  • Drive/participate in defining DFM/DFR/DFT, DOE, FMEA, TV design, material selections, identifying and improving critical process window and material attributes, defining reliability testsCIP, and executing manufacturing characterization.
  • Support and collaborate with business units and customers for product execution and alignments.
  • Responsible for package and product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, cost, and manufacturability.

 

Preferred Experience with:

  • Organic flip chip substrates, driving material choices, body sizes, manufacturability, and package constructions.
  • Industry wafer bump, assembly, substrate design features and technology, material trends, and design rules capability, for single chip, MCM, 2.5D Organic Flip Chip packages.

 

Academic Credentials:

  • Bachelor/Master of Science or equivalent in materials, mechanical, chemical, or electrical engineering, or related field with experience in Packaging development

 

Location:

Austin, Tx



Requisition Number: 82093 
Country: United States State: California City: Santa Clara 
Job Function: Packaging Engineering
  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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