Thermal Mechanical Engineering-89804

Location: Austin, Texas, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Thermal Mechanical Engineering


As a Sr. Thermal Mechnical Engineer in the Data Center GPU and Accelerated Processing Thermal Mechanical Engineering department, you will be responsible for the thermal and/or mechanical design and development of AMD’s Data Center GPU products in this expanding and strategic market for AMD.  In addition, you will also drive the thermal and/or mechanical design of these products at a module, card, and system-level.  The senior product development engineer will interact with other key engineering teams such as silicon design, packaging, platform validation, and manufacturing as well as leaders within AMD, our customers, and our partners.



The Sr. Product Development Engineer in the Thermal Mechanical Engineering department will have excellent communication skills, planning skills, technical expertise, is a team player, possesses critical problem solving and troubleshooting skills, is a self-starter, and is well organized. They will be market savvy and comfortable in a multi-tasking environment.



The Sr. Thermal Mechanical Engineering will be responsible for the end-to-end development and delivery of thermal and/or mechanical solutions for the GPU and advanced processing products.


The successful candidate will have a thermal or mechanical development background with silicon level or system level experience.  They will integrate into a global development team in delivering commercially viable products (silicon to systems) to the marketplace in a timely and cost-effective manner. 


The selected candidate will have the ability to ‘influence’ and effectively communicate their vision throughout the organization. They will be a driver of continuous improvement and new ways of thinking by promoting new ideas/perspectives around thermal and mechanical design, architectures, and product definition.


You will focus on:

  • Product scoping and definition of silicon-level thermal sensing and control features and architecture, thermal solution feasibility analysis, and scoping, including cost analysis for volume manufacturing. Understand the requirements from customers and system design and break down into thermal solution level requirements.
  • Product Design of graphics card thermal solutions, including CFD simulations, FEA and CAD design to meet or exceed the product requirements and schedule with an eye towards cost optimizations and industrial design considerations.
  • Characterization products through prototyping, test, and analysis. This includes creating test plans for thermal, mechanical, data analysis, debug, and optimization at a card-level and customer/reference system-level.
  • Technology Development from the chip-level to the system-level to constantly drive innovation and push the boundaries of electronics cooling and productize leading-edge technology for volume manufacturing.


This role requires considerable use of initiative and independent judgment – all within a framework of a tightly coordinated, uniformly-executing global team.




The Thermal Mechanical Engineering must have demonstrated the ability to be a constant force for innovation and improvement throughout their career.  Our selected candidate will use his/her proven leadership and architecture skills to ensure the engineering team continuously innovates, uses ‘best practices’, and adds value for its customers.


Critical Experiences & Competencies for Success:

  • Communication, Teamwork, and Problem Solving - Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion.
  • CAD - Experience with SolidWorks and/or Creo is required
  • CFD/FEA - Experience with Icepak and/or Flotherm is required. FEA experience in ANSYS is a plus.
  • Lab Skills - Experience with Design of Experiments, instrumentation, data acquisition and data analysis, including uncertainty analysis.
  • Manufacturing - Good knowledge of Design for Manufacturing, including experience with volume manufacturing in Asia as well as North America.
  • Teamwork - Effective collaboration with the entire company, operations, vendors, and external partners is particularly critical for success.  Leading by example and instilling effective teamwork throughout the organization is imperative.   



MS in Mechanical Engineering +3 years, or PhD +1 year relevant experience in electronics cooling-related Thermal and or Mechanical Engineering role.



Austin, Texas



Requisition Number: 89804 
Country: United States State: Texas City: Austin 
Job Function: Product Engineering


AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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