MTS Materials (Supplier Management)

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

MTS Packaging Engineer

 

THE ROLE:

This Position is for Materials Engr of External Manufacturing Operations stationed in Taiwan (HSINCHU). 

 

THE PERSON:

The applicant must be a team player with a commitment to meeting deadlines/Lead & Drive for solutions and an aptitude to thrive in a fast paced multi-tasking environment. The Ideal Candidate will have a technical knowledge in Materials (Substrate) and Packaging.

 

KEY RESPONSIBILITIES:

  • NPI/ HVM Yield Monitoring, Sustaining and Improvement, supplier & cross site qualification
  • Supplier Management - Substrate /Material supplier.
  • Supplier Assessment & Annual Audit
  • Best known Methods lesson learnt Fan out between supplier & Drive for CIP
  • Materials Spec management under External Manufacturing Operations_ Backend Engineering responsibility
  • Drives Supplier for feasibility, development and qualification for production of new packages & capability ahead of needs with respect to Roadmap
  • Job may include other duties as assigned by supervisor, depending on business requirements.
  • Supplier Scorecard management and Quarterly Technical Review to drive for improvement.

 

PREFERRED EXPERIENCE:

  • Strong interpersonal skills with good written & Oral Executive communication & Presentation skills.
  • Experience in Substrate Manufacturing, with product development, NPI to HVM will be an added advantage.
  • Possess statistical Knowledge (DOE, SPC/ 6sigma & data analysis) & technical report writing.
  • Time & Project Management skills.

 

ACADEMIC CREDENTIALS:

  • Degree in Material Science or Electrical/ Mechanical engineering or Equivalent with min. 9 years experience.

 

LOCATION:

Hsin-Chu, Taiwan

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV

 

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Requisition Number: 81437 
Job Function: Packaging Engineering  

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