MTS Package Engineer (External Manufacturing Operations - Backend Engineering)

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

MTS Packaging Engineer (External Manufacturing Operation, Back-end Engineering)

 

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement with external manufacturer (OSAT, Substrate suppliers, Lid & Stiffener suppliers) on delivering key performance indices in terms on Value Engineering projects, Supplier Manufacturing readiness, Excursion free processes and Enabling new capabilities.  

If you have a passion for excellence and a drive to achieve, you belong at AMD. Our employees, AMDer’s as we like to call them, work hard, have fun, and thrive on success. We meet the challenges of an evolving marketplace by staying true to our corporate values, including an unwavering respect for individuals and a focus on retaining superior employees.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology.

This is an extraordinary opportunity to work in an outstanding company like AMD - Join us!

 

THE PERSON:

 

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in Spoken & written English.

 

 

KEY RESPONSIBILITIES:

  • Plan and execute cost reduction initiatives master plan to achieve Annual Operating Plan (AOP) of external manufacturing operations team or any adhoc product/project specific cost requirement.
  • Coordinates and collaborates with Buyers/Finance on the spend analysis data and product cost model to identify commercial and/or technical opportunities. Identifies in conjunction with the Business Unit, products and suppliers for teardowns, proliferation and initiative generations.
  • Manages a large portfolio of cost reduction initiatives identified from initiation level, prototyping, qualification and ramp up into high volume manufacturing sustaining handoff.
  • Coordinates internal and market analysis to identify possible value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
  • Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness with lid & stiffener vendors.
  • Drive external manufacturer on issue resolution and issue prevention
  • Plan and execute change management from internal or external parties.
  • Occasionally to support on site audit and travelling.
  • May involve in regional supplier management.
  • Assist in additional duties as deemed fit by supervisor.

 

PREFERRED EXPERIENCE:

  • Solid working experience in the substrate manufacturing field as R&D or Process Engineering role
  • Rich knowledge in bumping process, substrate manufacturing process, lid & stiffener manufacturing process will be a great advantage.
  • Strong knowledge in Flip Chip Packaging.
  • Track record of development work leading to volume production in Semiconductor manufacturing.
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

 

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering.

 

LOCATION:

Hsinchu, Taiwan

 

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Requisition Number: 94929 
Job Function: Packaging Engineering  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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