MTS Packaging Engineer, Vendor Management

Location: Hsinchu, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.


Job Title:  Sr Engineer / MTS  (Vendor Management)


  1. Job Descriptions
  • Co-work with packaging BU’s on new product and technology development @ Assembly manufacturing facility. Proactively communicate task assignments to responsible parties, and ensure that tasks are completed within the planned time. Track projects to project plans. Proactively report project status to stakeholders.
  • Responsible for packaging yield, quality, cost and productivity improvement, and sustaining activities.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Drive Assembly manufacturer on issue resolution supporting packaging engineering.
  • Timely execution of special work requests, with comprehensive reports.
  • Monitor performance of Assembly manufacturing site regarding yield & quality, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Plan and execute change management from internal or external parties.
  • Drive Assembly manufacturer to enhance process, equipment & material capability for future generation/technology products.
  • Proactively drive towards continuous improvement in process standardization, simplification and quality enhancement, be it in internal and external environment.
  • Site specific engineering contact to support on evaluations & to support on site audit.
  • Assist in additional duties as deemed fit by supervisor.



2. Required skill sets

  • Min 5 years’ experience in Bump/Flip Chip/Fan-out/3D_TSV Packaging Engineering experience.
  • Possess C4 material & process knowledge (advantage).
  • Familiar with DOE and JMP.
  • MS degree in Mechanical or Material or Chemical Engineering.
  • Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on/ahead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.
  • Experience is Preparing reports /Presentation and ability to communicate Root cause and Resolution effectively.
  • Good interpersonal communication and presentation skill.
  • Fluent in both spoken and written English Languages.

Requisition Number: 74319 
Country: Taiwan State: Taiwan City: Hsinchu 
Job Function: Packaging Engineering 

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