MTS Packaging Engineer

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

KEY RESPONSIBILITIES:

• New supplier or new facility qualification

• Drive supplier on continuous improvement and new capabilities ahead of needed

• Proactively communicate with AMD internal stakeholders on new product development

• Plan and drive for New Product Introduction activities and Ramp Up readiness

• Drive suppliers on issue resolution and prevention

• Timely execution of special work requests, with comprehensive reporting

• Plan and execute change management from internal or external parties

• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment

• Provide disposition to out-of-control lots and present for Material Review Board (MRB)

• Occasionally to support on site audit

• May involve in regional supplier management

• Assist in additional duties as deemed fit by supervisor

 

PREFERRED EXPERIENCE:

• Strong interpersonal skills with effective communication & presentation skills

• Strong knowledge in ABF substrate process (while FC assembly process is added advantage)

• Familiar with tools (JMP, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive)

• Experience on project integration and management skills

 

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Engineering with minimum 8+ years experience

 

#LI-FL1



Requisition Number: 158641 
Job Function: Packaging Engineering  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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