Materials Manager, External Manufacturing Operations (Backend Engineering)

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Materials Manager, External Manufacturing Operations (Backend Engineering)



Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive & lead a team of engineers in supplier engagement with substrate manufacturer on delivering key performance indices in terms on NPI projects, Supplier Manufacturing readiness, Excursion free processes and Enabling new capabilities, BCP, Yield/Process Improvement. CIP’s, etc.




The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, strong interpersonal skills with good presentation skills, people management skill on career planning & development, day to day & regular coaching & monitoring. Good in Spoken & Written English.



  • NPI/ HVM Yield Monitoring, Sustaining and Improvement, New supplier & cross site qualification
  • Substrate Supplier Management, Supplier Scorecard management and Quarterly Technical Review to drive for improvement apart from Engineering Reviews.
  • Best known Methods lesson learnt Fan out between suppliers
  • Drive suppliers for Non-issue based CIP for Issue Prevention, apart from Issue based for Issue Resolution.
  • System Integration wherever needed to have real time update and control.
  • Drive Supplier for feasibility, development, and qualification for production of new packages & capability ahead of needs with respect to Roadmap.
  • Plan and drive suppliers for New Product Introduction activities and Ramp Up readiness.
  • Plan and execute change management from internal or external parties.
  • Managing a team of engineers – supervising & close monitor of KPIs, determining training & talents development, keeping track of budgets of expenses /project scope.
  • Occasionally to support on supplier site audit and travelling.
  • Assist in additional duties as deemed fit by supervisor.



  • The Ideal Candidate will be who have a balanced mix of technical knowledge as well as leadership/management experience in Substrate Manufacturing, with product development, NPI to HVM will be an added advantage, Packaging as well as Supplier Management.
  • Track record of development work leading to volume production in Semiconductor manufacturing.
  • The applicant must be a team player with a commitment to meeting deadlines/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.
  • Strong interpersonal skills with Effective Executive communication & Presentation skills.
  • Experience in managing horizontally across multiple internal functional organizations.
  • Possess statistical Knowledge (DOE, SPC/ 6sigma & data analysis) & technical report writing.
  • Familiar with tools (JMP, Minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).
  • Time & Project Management skills.



Bachelor/MS degree in Mechanical or Material or Chemical Engineering or Equivalent with profound experience.



Hsinchu, Taiwan



Requisition Number: 174566 
Job Function: Packaging Engineering  


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