Advanced Packaging Development and Integration

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

Apply now

Apply for Job

What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Advanced Packaging Development and Integration



Work with AMD manufacturing partners to develop new advanced packaging technology and integrate new products into high volume manufacturing.



The candidate should have a proven track record in developing advanced wafer level packaging technologies at OSAT, Foundry, or Fabless/IDM ecosystem.  He/She should have direct experience with developing wafer level process modules such as reconstitution, molding, RDL lithography, Cu-plating, mold grinding, PVD, Si-interposer processing, and singulation.  Experience with manufacturing of large chip modules is preferred.  He/she should have excellent oral and written communication skills to communicate ideas with technology partners, colleagues, product architects and AMD management.  The candidate will be able to coordinate with different teams internal and external to AMD.



  • Develop and productize advanced packaging technologies for AMD products
  • Select development partners to bring into AMD supply chain to invest and develop these concepts.
  • Work with development partners to assess risk of new package architecture concepts, then diagnose and solve manufacturing yield and reliability issues.
  • Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept though NPI.
  • Transfer the new product into a high yielding, efficient, high-volume manufacturing environment.



The candidate should have profound experience of semiconductor packaging, including direct experience with wafer level advanced packaging technologies at a OSAT, Foundry, or a Fabless/IDM ecosystem.



Master’s in Solid State Physics, Chemistry, Materials Science, Mechanical Engineering or equivalent.



Hsinchu, Taiwan




Requisition Number: 82941 
Job Function: Packaging Engineering  


AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

Apply now

Apply for Job

Share this Job