Principal Package Design Engineer

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Principal Package Design Engineer

 

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology.

This is an extraordinary opportunity to work in an outstanding company like AMD - Join us!

 

THE ROLE:

Member of advanced packaging group, focused on establishing design rules for heterogeneous packages with various 2D/2.5D/3D package architectures. Defines test chip/test vehicle strategy to qualify new technology building blocks. Partners with internal and external partners to optimize design and analyze performance vs yield trade-off.  Drive technology design rules with ecosystem partners and support package design, SI, PI studies on new packaging concepts to drive advanced packaging technologies to support new AMD products.

 

THE PERSON:

The candidate should have a proven track record in developing silicon and package design rules with ecosystem partners as well as hands on experience in test chip and substrate design. He/she should have deep expertise in silicon-package co-design on high performance computing applications, as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, product architects and AMD management.

 

KEY RESPONSIBILITIES:

  • Design and develop advanced packaging technologies for AMD products
  • Define and implement design for manufacturing/design for yield (DFM/DFY) guidelines
  • Silicon package design rule owner for advanced packaging programs
  • Ability to drive cost and SI/PI assessment based on design
  • Test chip, test vehicle design support

 

PREFERRED EXPERIENCE:

The candidate should have hands on experience with EDA tools such as Cadence, Synopsys, Mentor Graphics. Candidate should have experience with software development and scripting tools such as Python, PERL, SKILL etc. Successful candidate would have a proven track record of defining and implementing DFM/DFY rules. Demonstrated leadership/influencing skills working with cross functional teams as well as with OSAT/foundries partners to establish technology design rules. Statistical data analysis of test data using JMP/JSL, Python experience as well as yield engineering experience is a plus.

 

ACADEMIC CREDENTIALS:

Master’s in Electrical Engineering, Computer Science and Engineering or equivalent.

 

LOCATION:

Hsinchu, Taiwan

 

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Requisition Number: 90664 
Job Function: Packaging Engineering  

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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