Product Development Eng. - Process Technology Integration (117922)

Location: Hsinchu, Taiwan, TW

Company: Advanced Micro Devices

Apply now

Apply for Job

What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Product Development Eng. -  Process Technology Integration



The Process Technology Integration will interface with our foundry partner’s process integration teams in order to drive yield, performance and reliability for our high-volume CPU/GPU/APU manufacturing at the latest foundry nodes.  You will need to drive deeper engagement with the foundry to better understand their process, analyze the results of experiments and evaluations run at the foundry, help make the right decisions jointly in terms of evaluating and implementing process improvements, as well as provide the necessary technical inputs to other AMD teams across physical design, foundry operations, yield, product engineering, quality and reliability teams. This role will require you to interact closely with the foundry (across multiple fabs/nodes) and various global AMD teams.



You should have a passion for process technology and the desire to work at the cutting edge to make great products. You will need to “think like a process integration technologist” and influence the foundry and AMD global teams to make the right technology decisions for manufacturing AMD products. You should also be comfortable in data analysis of sort & WAT data from the foundry.



  • Your role will span the areas across the process flow i.e. FEOL, MEOL & BEOL integration respectively. FEOL/MEOL/BEOL Process Technology Integration: Provide expertise in process and integration for advanced FEOL/MEOL/BEOL process integration loops as below.
    • Isolation/fin/channel, epi/source-drain, spacer, gate stack and patterning. 
    • Replacement metal gate, Vt tuning, silicide and contact formation to active and gate. 
    • BEOL multi-patterning, full-stack (1x/2x/4x…) metal and via integration for trench-first and via-first integration schemes. Ability to work closely with bump/packaging and die-stacking/TSV teams building upon BEOL stacks.
  • Hands-on product yield analysis (hardbin, softbin & parametric data) as well as foundry WAT parameter analysis. Ability to carry out deeper product analysis including bitmap and scan diagnostics (training will be provided for in-house tools).
  • Detailed review of systematic defect and parametric signatures with the foundry, and oversight of process issues across products and technology nodes.
  • Jointly design and analyze process improvement (CIP/BKM) evaluations run at the foundry. Provide technical assessment for AMD process change review board for CIP/BKM roll-out decisions.
  • Close collaboration with device analysis teams to understand structural and parametric fail mechanisms for yield loss, potential reliability and quality issues, and deduce process failure mechanisms.
  • Interface with supplier quality & reliability engineering teams to provide technical inputs for potential process excursions/material review board, as well as to assess the root cause of reliability/HTOL fails and drive the right corrective actions in the process flow with the foundry.



  • Professional experience with any advanced semiconductor technologies (FinFET technology nodes preferred) such as 16/14/12/10/7/5nm …
  • Desired experience: good overall knowledge of FEOL, MEOL & BEOL integration as well as deeper hands-on experience in unit process modules and/or process integration:
    • FEOL: Diffusion/ ALD/ epi/ implant/ cleans/ litho/ FEOL etch/ RIE and FEOL integration loop such as multi-patterning/SADP, isolation/fin, epi/source-drain, spacer, gate stack and patterning.
    • MEOL: ALD/ CVD/ PVD/ Litho/ RIE/ ALE/ RTA/ CMP and MEOL integration loop such as multi-patterning/ SADP/ LELE, replacement metal gate, Vt tuning, silicide and contact formation to active and gate.
    • BEOL: Litho/ etch/ RIE/ PVD/ plating/ CVD/ CMP and BEOL integration loop such as metal/ via double patterning/ SADP/ LELE, trench-first and via-first integration schemes.
  • Knowledge of PFA and FI techniques used in Device Analysis, including the ability to deduce fail mechanisms
  • Strong communication skills so as to be able to interact with and influence a wide range of stakeholders including the (external) foundry and (internal) foundry interface, yield, product engineering, device analysis, test-chip and DFM and SoC design teams, in a globally distributed environment across time zones



Bachelor’s, Master’s or Ph.D. degree preferred in a technical field such as Electrical Engineering, Chemical Engineering, Materials Science and Engineering or Physics/Chemistry



Hsinchu, Taiwan



Requisition Number: 117922 
Job Function: Product Engineering  


AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

Apply now

Apply for Job

Share this Job