Package Design Engineer

Location: Hsinchu, TW

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.


Help turn "possibility" into "reality" every day.

It’s a rare opportunity to work on innovations that will redefine an industry for years to come.

AMD is bolder than ever, focused and energized - you can make a career move that matters!


Key Responsibilities:

* Conduct feasibilities study, together with silicon and PCB design to arrive at a design that will meet the design objective with regards to performance, cost and quality.

* Define process and methodologies to improve layout efficiency.

* Interact with Assembly houses and substrate vendors to achieve the most cost efficient design, meeting design and yield requirements.

* Deliver a substrate layout for AMD products, probe cards and test vehicles on schedule and meet the design objectives.

* Mentor Junior Colleagues to enhance layout practices to achieve the best in class package design.

Education Requirements:

* B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science


Skills and Experience Requirements:

* Minimum of 8 years experience on Package Design and/or ASIC Chip Design (Redistribution Layer)

* Knowledge on using CAD tools such as Cadence APD, AUTOCAD.

* Knowledge on Perl Script Programming

* Experience dealing with assembly and substrate subcontractors.

* Excellent communication and organizational skills.

* Team player and must be able to work well with others


Country: Taiwan State: Taiwan City: Hsinchu 

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