Packaging Engineer - 105223

Location: Markham, Ontario, CA

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

 

 

Packaging Engineer - 105223
 

The person

The candidate is an experienced Package Layout or Silicon Physical Layout Engineer that has excellent communication & project management skills and can complete the design task with least supervision. He/she should be able to work on a fast phase environment and collaborate well with others.

Key responsibilities

  • Codesign with Signal/Power Integrity and PCB design team to complete a substrate layout that will meet the design objectives for performance, cost and quality.

  • Support substrate design for probe card substrate , test chips and test vehicles for technology development.

  • Codesign with SOC team to complete Bump matrix and Interposer design for 2.5D, COWOS, INFO and other advanced packaging technologies ( Chiplet).

  • Contribute to the development and enhancements of process and methodologies to improve design efficiency.

  • Interact with Assembly houses and substrate vendors to achieve cost-efficient and high-quality design .

  • Mentor Junior Colleagues to enhance layout practices.

Preferred experience

  • Experienced on designing complex substrate design or Silicon Interposers.

  • Very good understanding of Signal Integrity and power integrity principles.

  • Knowledge on using CAD Layout tools such as Cadence SIP,APD 17.4, First Encounter, ICC2 or other Packaging or Silicon Physical Layout Software.

  • Knowledge on Perl or Skill Script Programming are a plus.

  • Experience dealing with assembly , foundry, and substrate vendors.

Academic credentials

  • B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science

Location

Markham, Ontario, Canada
 

AMD is a government contractor and subcontractor. As required by Executive Order, our US employees are required to be fully vaccinated against COVID-19 regardless of the employee’s work location or work arrangement (e.g., telework, remote work, etc.), subject to such exceptions as required by law. If selected, you will be required to be vaccinated against COVID-19 and submit documentation of proof of vaccination by December 8, 2021. AMD will provide additional information regarding what information or documentation will be needed and how you can request an exception from this requirement if you have a need for a religious and/or medical accommodation.

 

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Requisition Number: 105223
Country: Canada Province: Ontario City: Markham
Job Function: 
Packaging Engineering 
Hiring Manager: Liane Martinez

 

#LI-TW1

 

AMD is an inclusive employer dedicated to building a diverse workforce. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective provincial human rights codes throughout all stages of the recruitment and selection process. Any applicant who requires accommodation should contact AskHR@amd.com. AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services.

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