Packaging Engineer 2- 133881

Location: Markham, Ontario, CA

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.



Packaging Engineer - Advanced Technology

The Role

Work with AMD, customer, and supplier teams to drive technology and process development to enable advanced package architectures in new AMD products. 

The Person

The candidate should be a recent college graduate with exposure to semiconductor packaging technology.  A fundamental understanding of material science, electrical physics, and process technology is needed.  The candidate should have excellent communication skills to work closely with other packaging engineers around the world to achieve project objectives.

Key Responsibilities

  • Identify, develop, and productize cutting edge advanced packaging solutions for AMD products
  • Work with suppliers to scope, develop, and demonstrate new packaging technology process and materials.
  • Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements
  • Select development partners to bring into AMD supply chain to invest and develop these concepts.
  • Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI.
  • Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.


Preferred Experience

  • The candidate should be familiar with advanced packaging techniques including fan-out, 3D stacking, and 2.5D and packaging techniques for improved functionality at the lowest cost.


Academic Credentials

  • MS/PhD in Solid State Physics, Materials Science, and Engineering or equivalent.


Requisition Number: 133881 
Country: Canada Province: Ontario City: Markham 
Job Function:Packaging Engineering


AMD is an inclusive employer dedicated to building a diverse workforce. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective provincial human rights codes throughout all stages of the recruitment and selection process. Any applicant who requires accommodation should contact

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services.


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