Sr Packaging Engineer - 79555

Location: Markham, Ontario, CA

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.



Sr. Packaging Engineer

This Role:

AMD’s Packaging Engineering team is looking for an experienced Sr Packaging Engineer who will help seek sophisticated technical challenges to deliver robust, reliable, efficient packages & drive assembly solutions aligned with the end-product requirements. AMD is bolder than ever, focused, and energized - you can make a career move that matters! Help turn "possibility" into "reality" every day!

This person:

Will be responsible for packaging, product risk assessment, mitigation plans, and establishing best-known processes methodology to ensure robust package quality, reliability, and manufacturing yield. Performing risk assessments, creating program schedules, and ownership of successful project executions within target landmark schedules/customer commitments. Strong problem solving, communication, organizational, interpersonal, and presentation skills.

Key responsibilities:

  • Experience/knowledge with substrate design of Flip Chip organic packages, driving material choices, body sizes, manufacturability, and package constructions.
  • Ability to work with chip design architects, and product teams to recommend the optimum package solutions to support electrical, mechanical, and system-level needs to meet manufacturability, cost, and electrical performance requirements.
  • Interface closely with AMD’s assembly and material partners in Asia, to develop and bring up new packaging technology from definition to prototyping and mass production phases with acceptable sustaining yields.
  • Execute and coordinate Flip Chip 2.5D, MCM, single-chip assembly, and material manufacturability process characterization, NPI, CPI, qualifications of component and board level, Failure Analysis with the root cause and provide solutions to fix as required.
  • Experience with industry wafer bump, assembly, substrate technology, material trends, and design rules capability, for Flip Chip packages.
  • Drive/participate in defining DFM/DFR/DFT, DOE, FMEA, TV design, material selections, identifying and cornering critical process window and material attributes, defining reliability tests including detection and FA methodology, CIP, and executing manufacturing characterization.
  • Support and collaborate with customers to ensure that AMD packages/products can meet their operational needs.
  • Some international travel may be required.


  • Bachelor/Master of Science or equivalent in materials, mechanical, chemical, or electrical engineering, or related field with experience in Packaging development


  • Markham, On, CA




Requisition Number: 79555 
Country: Canada State: Ontario City: Markham 
Job Function:Packaging Engineering


AMD is an inclusive employer dedicated to building a diverse workforce. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective provincial human rights codes throughout all stages of the recruitment and selection process. Any applicant who requires accommodation should contact

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services.


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