External Manufacturing Operations-Backend Engineering (Fresh Graduate Hiring)

Location: Penang, Penang, MY

Company: Advanced Micro Devices

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What you do at AMD changes everything

 

We care deeply about transforming lives with AMD technology to enrich our industry, our communities and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence, while being direct, humble, collaborative and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.

AMD together we advance_

 

                                            External Manufacturing Operations-Backend Engineering (Fresh Graduate Hiring)

 

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Assembly manufacturer on delivering key performance indices in terms on New Product launch first time success, Process Improvements, Yield, Excursion free and Enabling new capabilities.  

 

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.

 

KEY RESPONSIBILITIES:

  • Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
  • Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly. Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time. Proactively report project status to stakeholders.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Drive external manufacturer on issue resolution and issue prevention
  • Timely execution of special work requests, with comprehensive reports.
  • Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Plan and execute change management from internal or external parties.
  • Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
  • Provide disposition to out-of-control lots and present for Material Review Board (MRB).
  • Occasionally to support on site audit and travelling.
  • May involve in regional vendor management.
  • Assist in additional duties as deemed fit by supervisor.

 

PREFERRED EXPERIENCE:

  • Strong knowledge in Flip chip Assembly process (while bumping process or substrate manufacturing process is added advantage)
  • Track record of development work leading to volume production in Semiconductor Assembly house.
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

 

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Mechanical or Material or Chemical

 

LOCATION:

Penang, Malaysia

 

#LI-FY

 



Requisition Number: 187145 
Country/Region/Location: Malaysia State/Province: Penang City: Penang 
Job Function: 
Packaging Engineering  

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