Packaging Engineer - 160023

Location: Santa Clara, California, US

Company: Advanced Micro Devices

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What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Job Description

AMD’s Packaging Engineering team is looking for an experienced IC Packaging Engineer who will help solve complex technical challenges to deliver robust, reliable, cost effective package & drive assembly solutions aligned with the end-product requirements. AMD is bolder than ever, focused and energized - you can make a career move that matters! Help turn "possibility" into "reality" every day!

 

 

Responsibilities

  • Manage package development projects at OSAT and substrate suppliers for next generation CPU products.
  • Develop design guidelines and assembly process techniques for advanced electronic packaging
  • Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities.
  • Utilize hands-on expertise of assembly processes for flip chip package development.
  • Coordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability.
  • Perform package design and construction feasibility studies to define new package concepts based on product requirements.
  • Research and develop substrate materials and manufacturing techniques, electronic packaging materials, assembly Processes, multi die stacking and 2.5D/3D package technologies
  • Solve technical issues on package reliability, materials and assembly process.
  • Participate in cross-functional teams to ensure on time flawless NPI.

Skills and Experience Requirements

  • BS degree in Mechanical or Chemical Engineering or Materials Science is required. MS or PhD degree is an added plus.
  • Semiconductor industry experience of 3 years is required.  Fresh college graduates with relevant projects & course work in electronic packaging will be considered in lieu of the industry experience.
  • Knowledge of flip chip assembly processes, package reliability testing, failure analysis is required.
  • Knowledge of package design using APD and FEA modeling for stress analysis is an added plus.
  • Proficiency in following software is required: AutoCAD, Word, Excel, Power Point & Agile.
  • Ability to work with manufacturing partners/suppliers.
  • Overall project management from conceptual phase to HVM.
  • Good written and verbal communication skills are required.

 

LI-SD1


Requisition Number: 160023 
Country: United States State: California City: Santa Clara 
Job Function: Packaging Engineering
  

Benefits offered are described here.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here for more information.

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