Senior Packaging Engineer (Vendor Management)

Location: Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

Job Title:  MTS/Senior Engineer (Packaging Engineering, Vendor Management)

 

  1. Job Descriptions
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Co-work with AMD internal stakeholders and drive risk assessment, processing requirement definition and qualification for new products and/or processes at external manufacturing facilities of Mark / VM/ Pack.
    • Depth and breadth f considerations and validation t allow seamless execution.
    • Practively communicate task assignments to responsible parties and ensure schedule cntrol with quality validation. Practively report project status to stakeholders.
  • Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Drive external manufacturer on issue resolution supporting packaging engineering
  • Timely execution of special work requests, with comprehensive reports.
  • Plan and execute change management from internal or external parties.
  • Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
  • Site support / Audit as needed with travel.
  • May involve in regional vendor management.
  • Assist in additional duties as deemed fit by supervisor.

 

 

2. Required skill sets

  • Min 5 years’ experience in Semiconductor packaging, especially in Test, Mark and Pack process with good knowledge of quality system.
  • Track record of development work leading to volume production for packaging technology.
  • Good industrial knowledge of package moisture, inspection capability and packaging design.
  • Familiar with statistical control tools, DOE and JMP and basic Autocad.
  • Bachelor/MS degree in Mechanical or Material or Manufacturing Engineering
  • Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
  • Excellent cross functional project management, management, and presentation skills.
  • Good in writing and speaking in English

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Requisition Number: 75128 
Country: Singapore State: Singapore City: Singapore 
Job Function: Packaging Engineering 

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