MTS Packaging Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.


MTS Packaging Engineer, External Manufacturing Operations (Backend Engineering)



Candidate is required to drive programs/projects within External Manufacturing Operations -Backend Engineering, while delivering Key Performance Indices in terms of product and substrate bring-up for NPI and Advance Technology projects.



The ideal candidate will have a balanced mix of strong technical knowledge as well as program management experience in Bumping/Packaging and Substrate Functions.

The successful candidate must be a team player with a commitment to meeting deadlines. Lead & drive for solutions with an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, with strong interpersonal skills and good communication & presentation skills. He or she must have good command of both written and spoken English. 



  • Formulate, organize, coordinate, and drive interconnected programs or key initiatives with cross functional team members in accordance with the mission and goals of the organization.
  • Responsibilities will include driving Key Program deliverables/ schedules/ budget & analyze program risk and opportunities.
  • Be responsible for effective communication across organizations/ levels for program status update (both working details to the team, and executive summary for Executive communication).
  • The role will require working together with both internal engineering counterparts & extensive interactions within the Package engineering organization, and interacting with several other internal organizations (procurement, supply chain, reliability, etc.) on program deliverables with accurate and timely reporting of program status with executive summary update throughout its life cycle.
  • Developing new programs to support the strategic direction of the organization.
  • Job may include other duties as assigned/ deemed fit by supervisor.



  • Minimum 12 years of work experience in Process Integration or Product Engineering with Program Management experience.
  • Strong knowledge in Flip chip Assembly process (while bumping process is added advantage)
  • Creative, self-driven, highly motivated individual with demonstrated ability to independently manage complex engineering tasks.
  • Strong interpersonal communication, analytical, project management, task & time management, and with excellent communication skills.
  • Experience in managing horizontally across multiple internal functional organization.
  • Experience in semiconductor engineering environment, with NPI to HVM experience.



  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering




AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV



Requisition Number: 104746 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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