SMTS Packaging Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

SMTS Package Engineering, External Manufacturing Operations (Backend Engineering)

The role:

We are looking for a candidate that can drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

 

The person:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her works with minimum supervision and strong interest to grow in people management ladder.

 

Key responsibilities:

  • Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders.
  • Drive external manufacturer on issue resolution and issue prevention
  • Plan and execute change management from internal or external parties.
  • Involve in regional supplier management – drive to meet Key Performance Indices
  • Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
  • Prepare & present Executive Summary of projects and supplier’s performance
  • Coordination of activities within/external team to deliver critical metrics.
  • Overseas travelling as required.
  • Assist in additional duties as deemed fit by supervisor.

 

Preferred experience:

  • Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is added advantage)
  • Track record of development work leading to volume production in Semiconductor manufacturing.
  • Good leadership and interpersonal relationship.
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

 

Academic credentials:

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • Min. 8 years of working experience in Backend Semiconductor.

 

Location:

Singapore

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV

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Requisition Number: 113204 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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