MTS Packaging Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.


Job Title: MTS Engineer (External Manufacturing Operations, Backend Engineering)


AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!


  1. Job Descriptions
  • Manage New Product Introduction activities and Product Ramp Up monitoring for post-test processes by working closely with AMD internal stakeholders.
  • Co-work partners and drive risk assessment, processing requirement definition and qualification for new products and/or processes at external manufacturing facilities for Mark / Inspection / Pack.
  • Depth and breadth of considerations and validation to allow seamless execution of new product bringup and LVM production ramp.
  • Proactively communicate task assignments/status to responsible parties and ensure schedule control with quality validation.
  • Manage external manufacturing sites to ensure parts are manufactured to product specifications and achievement of product manufacturing KPI.
  • Drive on issue resolution / opportunities for improvement supporting on process improvement and quality enhancement..
  • Drive external manufacturing sites on technical cause and improvement for quality excursion resolution feedback from end customers.
  • Timely execution of projects and special work requests, with comprehensive reports and analysis.
  • Manage and execute Engineering change management / change controls and BOM changes.
  • Site support / Audit as needed with travel.
  • Will be involved in regional vendor management.
  • Assist in additional duties as needed by supervisor.


2. Required skill sets

  • Min 8 years’ experience in Semiconductor packaging, focusing in the following areas - Test, Mark and Pack process with good knowledge of quality system.
  • Strong technical knowledge on marking technology and vision inspection machine technology is an advantage.
  • Experience in NPI / DFM and product shipping packaging qualification.
  • Supplier management experience (OSAT) preferred.
  • Experience with 8D problem solving techniques.
  • Familiar with statistical control tools, DOE and JMP and basic Autocad.
  • Bachelor/MS degree in Mechanical or Material or Manufacturing Engineering
  • Creative, highly motivated individual with the proven track record to independently complete sophisticated engineering tasks
  • Excellent multi-functional project management, communication, and presentation skills.




AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV



Requisition Number: 113241 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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