Signal Integrity Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

Apply now

Apply for Job


What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

MTS PACKAGING ENGINEER (SIGNAL INTEGRITY)

THE ROLE

The Packaging Signal Integrity engineering team ensures that the performance and cost requirements of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.

 

THE PERSON

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills.

 

KEY RESPONSIBILITIES

  • As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design, simulation and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board.
  • You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving.

 

SKILLS and Experience requirements

  • Experience in SI/PI simulation and processing s-parameters
  • Experience in measurement tools VNA, high speed oscilloscope and TDR
  • Experience in test board design, measurement fixtures and de-embedding methodologies
  • Experience in packaging, connector and board design for signal integrity and power integrity
  • Experience in high-speed digital signaling interfaces such as PCIE, GDDR6, HDMI and USB
  • Experience in electrical modeling EDA tools such as HFSS, SIwave, ADS
  • Knowledge in analog characterization, electromagnetic theory and digital circuit analysis
  • Knowledge in packaging assembly and IC testing is another plus
  • Skills in developing and mentoring team members is a plus
  • Ability to collaborate and work across different functional teams and different sites
  • Self-driven and can work independently

 

ACADEMIC CREDENTIALS

  • Master’s degree is preferred
  • > 5 years relevant experience preferred

 

LOCATION:

Singapore


AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV

 

#LI-JV1

 



Requisition Number: 165693 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

Apply now

Apply for Job

Share this Job