MTS Packaging Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.




The Packaging Signal Integrity engineering team ensures that the performance and cost requirements of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.


As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design, modeling, simulation and characterization of high-speed signal propagation and power delivery networks in AMD products covering silicon, package, connectors and board.  You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving.


  • > 10 years relevant experience preferred
  • Experience with PCB, Package and IC level power delivery networks
  • Experience in packaging, connector and board design for signal integrity
  • Experience with high-speed digital signaling interfaces such as PCIE, GDDR5, HDMI and USB
  • Experience with electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE
  • Experience with measurement tools VNA, high speed oscilloscope and TDR
  • Expertise in test board design, measurement fixtures and de-embedding methodologies
  • Expertise in electromagnetic theory and circuit analysis
  • Skills in developing and mentoring team members is a plus
  • Knowledge in packaging assembly and IC testing is another plus
  • Ability to effectively communicate ideas and results
  • Ability to collaborate and work across different functional teams
  • Self-driven and can work independently



  • MS or Ph.D. preferred





AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV



Requisition Number: 77612 
Country: Singapore State: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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