Senior Package Design Engineer

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

Senior Package Design Engineer

 

Help turn "possibility" into "reality" every day. It’s a rare opportunity to work on innovations that will redefine an industry for years to come. AMD is bolder than ever, focused and energized - you can make a career move that matters! AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

 

KEY RESPONSIBILITIES:

  • Codesign with Signal/Power Integrity and PCB design team to complete a substrate layout that will meet the design objectives for performance, cost and quality.
  • Support substrate design for probe card substrate, test chips and test vehicles for technology development.
  • Codesign with SOC team to complete Bump matrix and Interposer design for 2.5D, COWOS, INFO and other advanced packaging technologies (Chiplet).
  • Contribute to the development and enhancements of process and methodologies to improve design efficiency.
  • Interact with Assembly houses and substrate vendors to achieve cost-efficient and high-quality design.

 

PREFERRED EXPERIENCE:

  • 3 - 5 years’ experience on Package Design and/or ASIC Chip Design
  • Knowledge on using CAD Layout tools such as Cadence SIP and APD 17.4.
  • Knowledge on Perl or Skill Script Programming are a plus.
  • Experience dealing with assembly and substrate subcontractors.
  • Excellent communication and project management skills.
  • Team player and must be able to work well with others

 

ACADEMIC CREDENTIALS:

  • B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science

 

LOCATION:

Singapore

 

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AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV



Requisition Number: 99243 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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