Sr. Packaging Engineer (CAD and Documentation)

Location: Singapore, Singapore, SG

Company: Advanced Micro Devices

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What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

Sr Packaging Engineer

Help turn "possibility" into "reality" every day. It’s a rare opportunity to work on innovations that will redefine an industry for years to come. AMD is bolder than ever, focused and energized - you can make a career move that matters! AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

 

KEY RESPONSIBILITIES:

  • Create and maintain packaging documentation which includes package outline drawings, Stiffener and Lid drawings .
  • Collaborate with engineering teams to create and maintain package design specifications.
  • Communicate and coordinate with substrate vendors in completing Substrate Outline Drawings.
  • Support the creation and release of Assembly kits and BOM to AGILE system.
  • Create Part numbers for various packaging parts and documentations.

 

PREFERRED EXPERIENCE:

  • Working experience in a Package design, PCB design, Product engineering environment.
  • Working knowledge on EDA tools Cadence APD 17.2 or 17.4 and AutoCAD.
  • Experienced in using AGILE and Sharepoint system.
  • Good computer skills and proficient in MS office.
  • Excellent communication and organizational skills.
  • Team player and must be able to work well with others.

 

ACADEMIC CREDENTIALS:

  • Electrical Engineering, Mechanical Engineering, Computer Engineering or Engineering Science.

 

LOCATION:

Singapore

 

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV


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Requisition Number: 96332 
Country/Region/Location: Singapore State/Province: Singapore City: Singapore 
Job Function: 
Packaging Engineering  

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