78732_Packaging Engineer-Flip Chip Assembly/ Bumping

Location: Suzhou, JiangSu, CN

Company: Advanced Micro Devices

Apply now

Apply for Job


What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

THE ROLE:

Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip Assembly/ Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.  

 

THE PERSON:

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in writing and speaking in English. Last but not least, be able to cope with stress!

 

 

KEY RESPONSIBILITIES:

  • Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
  • Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly. Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time. Proactively report project status to stakeholders.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Drive external manufacturer on issue resolution and issue prevention
  • Timely execution of special work requests, with comprehensive reports.
  • Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Plan and execute change management from internal or external parties.
  • Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
  • Provide disposition to out-of-control lots and present for Material Review Board (MRB).
  • Occasionally to support on site audit and travelling.
  • May involve in regional vendor management.
  • Assist in additional duties as deemed fit by supervisor.

 

PREFERRED EXPERIENCE:

  • Strong knowledge in Flip chip Assembly process (while bumping process is added advantage)
  • Track record of development work leading to volume production in Semiconductor Bumping/ Assembly house.
  • Package stress simulation
  • Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

 

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering

 

LOCATION:

Suzhou

 

APPLY:

Email to bella.yu@amd.com

#LI-BY1



Requisition Number: 78732 
Country: China State: JiangSu City: Suzhou 
Job Function: 
Packaging Engineering  

Apply now

Apply for Job

Share this Job