Packaging Engineer-Bumping

Location: Suzhou, CN

Company: Advanced Micro Devices

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What you do at AMD changes everything 


At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 


Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

 

Job Title:  Packaging Engineering, Vendor Management

 

  1. Job Descriptions
  • Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly. Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time. Proactively report project status to stakeholders.
  • Plan and drive for New Product Introduction activities and Ramp Up readiness.
  • Drive external manufacturer on issue resolution supporting packaging engineering
  • Timely execution of special work requests, with comprehensive reports.
  • Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Plan and execute change management from internal or external parties.
  • Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
  • Provide disposition to out-of-control lots and present for Material Review Board (MRB).
  • Occasionally to support on site audit and travelling.
  • May involve in regional vendor management.
  • Assist in additional duties as deemed fit by supervisor.

 

 

2. Required skill sets

  • Min 5 years’ experience in Semiconductor packaging, especially in Solder/Copper Pillar Bumping, and Wafer Level fan out process.
  • Track record of development work leading to volume production for bump processing.
  • Good knowledge of bump fab materials (sputter, electroplating, photoresists, ball place, AVI) and integration.
  • Familiar with DOE and JMP.
  • Bachelor/MS degree in Mechanical or Material or Chemical Engineering
  • Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
  • Excellent cross functional project management, management, and presentation skills.
  • Good in writing and speaking in English

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Requisition Number: 74313 
Country: China State: JiangSu City: Suzhou 
Job Function: Packaging Engineering 

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