External Manufacturing Operations (Backend Engineering)

Location: Tokyo, Tokyo-to, JP

Company: Advanced Micro Devices

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What you do at AMD changes everything 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.


External Manufacturing Operations (Backend Engineering)



This Position is for Materials Engr of External Manufacturing Operations stationed in Japan (Tokyo). 



The applicant must be a great teammate with a dedication to meeting deadlines/Lead & Drive for solutions and an aptitude to thrive in a fast paced multi-tasking environment. The Ideal Candidate will have a technical knowledge in Materials (Substrate) and Packaging.



  • NPI/ HVM Yield Monitoring, Sustaining and Improvement, supplier & cross site qualification
  • Supplier Management - Substrate /Material supplier.
  • Supplier Assessment & Site Audit Regularly.
  • Best known Methods lesson learnt Fan out between supplier & Drive for CIP.
  • Drive Substrate Supplier on issue resolution and issue prevention.
  • Materials Spec management under External Manufacturing Operations_ Backend Engineering responsibility.
  • Drives Supplier together with packaging team for feasibility, development and qualification for production of new product substrate & capability ahead of needs with respect to Roadmap.
  • Supplier Scorecard management and Quarterly Technical Review to drive for improvement.
  • Frequent site check & FtF meetings with substrate suppliers is required with Travel.
  • Plan and execute change management from internal or external parties.
  • To manage supplier EDNC  and related issue resolution.
  • Job may include other duties as assigned by supervisor, depending on business requirements.



  • Strong interpersonal skills with good written & Oral Executive communication & Presentation skills.
  • Experience in Substrate Manufacturing, with product development, NPI to HVM will be an added advantage.
  • Possess statistical Knowledge (DOE, SPC/ 6sigma & data analysis) & technical report writing.
  • Time & Project Management skills.
  • Excellent communication in Japanese and English language.



Degree in Material Science or Electrical/ Mechanical engineering or Equivalent



Tokyo, Japan



Requisition Number: 95084 
Country/Region/Location: Japan State/Province: Tokyo-to City: Tokyo 
Job Function: 
Packaging Engineering  

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